Product Example: Lead Frame
Introducing custom precision lead frames for small signal transistors and optical semiconductors!
Here is an introduction to a case study on the production of lead frames used in discrete (individual) semiconductor small signal packages. The materials for the lead frames are mainly Cu alloys and 42 Alloy, with thicknesses ranging from 0.08 to 0.2 mm. The punching parts achieve a processing accuracy of ±0.02 mm, resulting in high-quality lead frames. 【Case Study】 ■ Product: Lead frame for small signal transistors ■ Industry: Semiconductor ■ Processing Classification: Press, punching, bending ■ Accuracy: ±0.02 mm (punching parts) ■ Material: Cu alloy, 42 Alloy *For more details, please refer to the PDF document or feel free to contact us.
- 企業：姫路東芝電子部品
- 価格：Other
